US Patent Issued to Yangtze Memory Technologies on June 9 for "Chip package structure and manufacturing methods for the same" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,033, issued on June 9, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).

"Chip package structure and manufacturing methods for the same" was invented by Xinru Zeng (Wuhan, China), Xin Feng (Wuhan, China) and Peng Chen (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides chip package structures and manufacturing methods thereof. In one example, the chip package structure includes: a base board including a grounding pad; a chip assembly located at a first surface of the base board; a package body covering the chip assembly, wherein a side wall of the package body is located in an extension dir...