ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,471, issued on Aug. 18, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China).
"Semiconductor package" was invented by Zhiguo Li (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the present disclosure, a semiconductor package is provided. The semiconductor package may include a first semiconductor chip. The semiconductor package may include at least one second semiconductor chip. The semiconductor package may include a switch protection circuit having a first end connected with the first semiconductor chip and a second end connected with each of the at least one second semiconductor chip. When the...