US Patent Issued to Yamaha Robotics on March 3 for "Semiconductor device manufacturing device and manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,792, issued on March 3, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Semiconductor device manufacturing device and manufacturing method" was invented by Yuji Eguchi (Tokyo) and Kohei Seyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing device (10) includes a stage (12), an installing head (14) that has a chip holding surface (26) and disposes a chip (100) on a substrate (110), a measuring mechanism (16) that measures a tilt angle of the chip (100) loaded on an installing surface (112) of the substrate (110) by the installing head (14) with respect to the installing surface (112) as a detection tilt ...