ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,004, issued on Dec. 2, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).
"Surface treatment apparatus and manufacturing apparatus for semiconductor device" was invented by Hiroshi Kikuchi (Tokyo), Kin Ri (Tokyo) and Tetsuo Takano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A surface treatment apparatus applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding. The surface treatment apparatus includes a support base and a spray nozzle. The support base supports a surface of the target object opposite to the bonding sur...