US Patent Issued to Yamaha Robotics on Dec. 2 for "Measurement device, measurement method, and bonding system" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,076, issued on Dec. 2, was assigned to Yamaha Robotics Co. Ltd. (Tokyo).

"Measurement device, measurement method, and bonding system" was invented by Shinichi Yoshida (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention can provide a measurement device, a measurement method, and a bonding system, which enable estimation of the state of the underside of an electronic component mounted on a substrate. A measurement device performs measurements on an electronic component that is mounted on a main surface of a substrate, the measurement device comprising: a measurement part that measures a component height position, which is the he...