US Patent Issued to xMEMS Labs on July 21 for "Heat dissipating structure and heat dissipating method thereof" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,158, issued on July 21, was assigned to xMEMS Labs Inc. (Santa Clara, Calif.).

"Heat dissipating structure and heat dissipating method thereof" was invented by Thomas Tarter (San Jose, Calif.) and Jemm Yue Liang (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating structure and a heat dissipating method are disclosed. The heat dissipating structure includes a duct, which has a channel formed in the duct, and an airflow generating device. The heat dissipating structure is disposed on, by or over a semiconductor device and configured to dissipate heat generated from the semiconductor device. The airflow generating devic...