US Patent Issued to Xintec on Nov. 3 for "Chip package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,462, issued on Nov. 3, was assigned to Xintec Inc. (Taoyuan City, Taiwan).

"Chip package and manufacturing method thereof" was invented by Wei-Ming Chien (Taoyuan City, Taiwan), Po-Han Lee (Taipei City, Taiwan), Tsang Yu Liu (Zhubei City, Taiwan) and Joey Lai (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a light transmissive sheet, a chip, a bonding layer, and an insulating layer. The light transmissive sheet has a protruding portion. A first surface of the chip faces toward the light transmissive sheet and has a sensing area. The bonding layer is located between the chip and the light transmissive sheet...