ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,748, issued on May 19, was assigned to Xinmei Fontana Holding (Hong Kong) Ltd. (Hong Kong).
"Pressure-sensitive adhesive" was invented by Byung Su Park (Daejeon, South Korea), Hyun Cheol Kim (Daejeon, South Korea), Hui Je Lee (Daejeon, South Korea), Seung Yeon Ryu (Daejeon, South Korea) and Jin Ho Son (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and wor...