US Patent Issued to XINGR TECHNOLOGIES (ZHEJIANG) on Sept. 1 for "Wafer test cassette, wafer test system and wafer test method" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,724,064, issued on Sept. 1, was assigned to XINGR TECHNOLOGIES (ZHEJIANG) Ltd. (Yiwu City, China).

"Wafer test cassette, wafer test system and wafer test method" was invented by Choon Leong Lou (Singapore) and Ho Yeh Chen (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to ...