ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,607, issued on July 28, was assigned to XILINX INC. (San Jose, Calif.).
"Integrated circuit protection using stacked dies" was invented by James D. Wesselkamper (Albuquerque, N.M.), Thomas Paul Leboeuf (Sandia Park, N.M.), Steve E. Mcneil (Los Ranchos, N.M.), Jason J. Moore (Albuquerque, N.M.) and James Anderson (Madison, Ala.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked integrated circuit devices, chip packages and methods for operating a chip package are described herein that provide an increased level of backside protection from physical attacks that could compromise confidentiality or authentication of the integrated circuit device. In...