ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,052, issued on Feb. 24, was assigned to XILINX INC. (San Jose, Calif.).
"Chip package with pass through heat spreader" was invented by Gamal Refai-Ahmed (Santa Clara, Calif.) and Suresh Ramalingam (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to th...