US Patent Issued to XILINX on Aug. 4 for "Chip package integration with hybrid bonded bridge die" (California, Colorado Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,065, issued on Aug. 4, was assigned to XILINX INC. (San Jose, Calif.).

"Chip package integration with hybrid bonded bridge die" was invented by Jaspreet Singh Gandhi (San Jose, Calif.) and Brian C. Gaide (Erie, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and method for fabricating the same are provided that include hybrid bonded bridge dies connecting IC dies on adjacent die stacks. In one example, a chip package includes an interconnect routing structure, a first die stack and a second die stack. The first die stack includes a top die disposed over a bottom die, the bottom die stacked on the interconnect routing structure. Th...