US Patent Issued to XIAMEN SILAN ADVANCED COMPOUND SEMICONDUCTOR on Feb. 10 for "Flip LED chip and manufacturing method therefor" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,495, issued on Feb. 10, was assigned to XIAMEN SILAN ADVANCED COMPOUND SEMICONDUCTOR Co. LTD (Xiamen, China).

"Flip LED chip and manufacturing method therefor" was invented by Xiaoping Zhang (Xiamen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a flip-chip LED, comprising: an epitaxial layer on a surface of a substrate, and comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer arranged in sequence from bottom to top, wherein a mesa in the epitaxial layer has an upper surface provided by the second semiconductor layer, a lower surface provided by the first semiconductor layer, and a side ...