ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,504, issued on Sept. 2, was assigned to XIAMEN SAN'AN OPTOELECTRONICS Co. LTD. (Xiamen, China).
"Flip-chip light emitting diode and manufacturing method thereof" was invented by Wei-Ping Xiong (Xiamen, China), Shu-Fan Yang (Xiamen, China), Chun-Yi Wu (Xiamen, China) and Chaoyu Wu (Xiamen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flip-chip light emitting diode includes a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface; a transparen...