US Patent Issued to XI'AN SMART MATERIALS on Aug. 25 for "Composition for use in photoelectronic component packaging, packaging structure, and photoelectronic component" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,945, issued on Aug. 25, was assigned to XI'AN SMART MATERIALS Co. LTD. (Shaanxi, China).

"Composition for use in photoelectronic component packaging, packaging structure, and photoelectronic component" was invented by Zhaoxin Wu (Shaanxi, China), Ting Lei (Shaanxi, China), Lu Li (Shaanxi, China), Guijiang Zhou (Shaanxi, China) and Yuhong Liu (Shaanxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a composition for use in photoelectronic component encapsulated, an encapsulation structure and a photoelectronic component. The composition includes 10%~70% of a photocurable monomer; 10%~70% of a monofunctional or trifunctional silico...