US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Overlay mark, overlay error measurement method for wafer, and wafer stacking method" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,697, issued on Aug. 18, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Overlay mark, overlay error measurement method for wafer, and wafer stacking method" was invented by Yicheng Feng (Wuhan, China), Yuheng Huang (Wuhan, China) and Bang Chen (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an overlay mark, an overlay error measurement method for a wafer, and a wafer stacking method. The overlay mark includes a first overlay mark disposed on a first layer, and a second overlay mark disposed on a second layer. The first layer and the second layer are stacked. The first ov...