US Patent Issued to Worldwide Pro on Feb. 10 for "Hierarchical 3D structure generation and intelligent compaction method using barycenter compaction model" (California Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,810, issued on Feb. 10, was assigned to Worldwide Pro Ltd. (Hong Kong).

"Hierarchical 3D structure generation and intelligent compaction method using barycenter compaction model" was invented by William Wai Yan Ho (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique generates a hierarchical three-dimensional structure or volume mesh and uses intelligent compaction using a Barycenter compact model. Any primitive cells or blocks can be represented physically by a Barycenter compact model (or Barycenter model), and any black box model can also be physically represented by a Barycenter compact model physically. A boundary condit...