US Patent Issued to Wolfspeed on Feb. 10 for "Packages with backside mounted die and exposed die interconnects and methods of fabricating the same" (Arizona, California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,744, issued on Feb. 10, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Packages with backside mounted die and exposed die interconnects and methods of fabricating the same" was invented by Michael DeVita (Mesa, Ariz.) and Qianli Mu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device includes forming a protective structure on at least one die on a substrate. The protective structure exposes one or more electrical contacts on a first surface of the at least one die. Respective terminals are formed on the one or more electrical contacts exposed by the protective structure. Related packages an...