US Patent Issued to Wistron NeWeb on Nov. 3 for "Heat dissipation structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,153, issued on Nov. 3, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan).

"Heat dissipation structure" was invented by Chieh Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure including a circuit board, a heat component, a metal component, a heat dissipation medium, and a heat sink is proposed. The heat component is connected to one side of the circuit board. The metal component is connected to another side of the circuit board and has a first concave-convex surface. The heat dissipation medium is connected to the metal component. The heat sink is connected to the heat dissipation medium and has a sec...