ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,739, issued on Oct. 14, was assigned to Wisconsin Alumni Research Foundation (Madison, Wis.).

"Device and method for evaluating the susceptibility of hot cracking in additive manufacturing" was invented by Sindo Kou (Madison, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device and method are provided for evaluating the susceptibility of hot cracking in an additive manufacturing process. A first end of a substrate is interconnected to a base and one of the base and a deposition device is moved in a first direction and the second end of the substrate is pulled. A powder is dispensed at a selected rate and an energy bean having an adjustable p...