US Patent Issued to Winbond Electronics on Oct. 27 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,634, issued on Oct. 27, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Wei-Zhi Fang (Tainan City, Taiwan), Shu-Ming Li (Taichung City, Taiwan) and Tzu-Ming Ou Yang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The method of forming the semiconductor structure includes the following steps. Bit line structures are formed on a substrate. A first liner is formed on the bit line structures. A second liner is formed on the first liner. A portion of the second liner is removed to expose a portion of the top surface of the first liner. A port...