US Patent Issued to Winbond Electronics on Nov. 3 for "Method for forming semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,732, issued on Nov. 3, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Method for forming semiconductor structure" was invented by Che-Fu Chuang (Changhua City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure, comprising: forming a stacked structure on a substrate, the stacked structure including a cap structure including first and second cap layers of different materials; sequentially forming first and second spacer material layers on the substrate and the stacked structure; removing a first portion of the second spacer material layer and a first portion of the first spacer mat...