US Patent Issued to WINBOND ELECTRONICS on March 3 for "Method for forming memory patterns and wire patterns simultaneously" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,616, issued on March 3, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Method for forming memory patterns and wire patterns simultaneously" was invented by Ling-Chun Tseng (Taichung City, Taiwan), Tzu-Ming Ou Yang (Taichung City, Taiwan) and Pin-Han Chiu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor memory structure includes the following steps. A first patterned hard mask layer is formed over a conductive material. The first patterned hard mask layer includes first strip patterns and a mesa pattern. The mesa pattern is connected with the first strip patterns. A second ...