US Patent Issued to Winbond Electronics on March 24 for "Secure stacking of memory dies" (Israeli Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,780, issued on March 24, was assigned to Winbond Electronics Corp. (Park Taichung City, Taiwan).

"Secure stacking of memory dies" was invented by Itay Admon (Pardes Hanna, Israel) and Nir Tasher (Herzliya, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC includes a primary memory die and a secondary memory die. The primary memory die is coupled to a bus providing a primary Chip Select (CS) signal via a primary CS line that connects to the primary memory die. The secondary memory die is coupled to the bus, excluding the primary CS line, and to a secondary CS line carrying a secondary CS signal provided by the primary memory die. The prima...