US Patent Issued to WINBOND ELECTRONICS on March 17 for "Semiconductor structure and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,644, issued on March 17, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Shou-Te Wang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method of forming the same are provided. The semiconductor structure includes a substrate, a word line structure, a dielectric structure, a contact plug, and a sidewall insulating layer. The substrate includes an active region. The word line structure is disposed in the substrate and in the active region. The dielectric structure is disposed on the word line structure. The ...