US Patent Issued to WINBOND ELECTRONICS on June 9 for "Semiconductor device and method forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,024, issued on June 9, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor device and method forming the same" was invented by Hsin-Hung Chou (Taichung City, Taiwan) and Kao-Tsair Tsai (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: forming a patterned dielectric layer, including a predetermined word line region and a predetermined pick-up neck region being separated by a first distance, and the patterned dielectric layer within the predetermined pick-up neck region has a second distance, wherein the first distance is smaller than or equal to the second distance; forming a spacer ...