US Patent Issued to Winbond Electronics on June 23 for "Semiconductor memory device and test method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,041, issued on June 23, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Semiconductor memory device and test method thereof" was invented by Chih-Chiang Lai (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory device and a test method thereof are provided. The semiconductor memory device includes a plurality of word lines, a row decoder, a first voltage pump circuit, a first programmable current comparator and a control circuit. The row decoder decodes a row address data and accordingly selects a test word line to be electrically connected to a first test path. The first voltage pump circuit is ...