US Patent Issued to Winbond Electronics on July 14 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,764, issued on July 14, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Mei-Yuan Chou (Taichung City, Taiwan) and Yoshinori Tanaka (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device, including a first MOS device, a second MOS device, a first dielectric layer, a stop layer, and a second dielectric layer, is provided. The first MOS device and the second MOS device are located on a substrate. The first dielectric layer is beside the first MOS device and the second MOS device. The stop layer is disposed on the first di...