US Patent Issued to WINBOND ELECTRONICS on Feb. 10 for "Semiconductor memory structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,313, issued on Feb. 10, was assigned to WINBOND ELECTRONICS CORP. (Taichung, Taiwan).

"Semiconductor memory structure and method for forming the same" was invented by Ying-Chu Yen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory structure includes an isolation structure surrounding an active region in a substrate. The structure also includes two word lines disposed in the active region. The structure also includes a bit line contact disposed between two word lines. The structure also includes a first bit line disposed over the bit line contact. The bit line contact includes polysilicon and has a concave top sur...