US Patent Issued to WINBOND ELECTRONICS on April 21 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,941, issued on April 21, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Yen-Chiao Chen (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes vertical conductive features disposed over a substrate, and horizontal conductive features disposed over the vertical conductive features. The horizontal conductive features include first and second conductive lines respectively electrically connected to the first and second vertical conductive features, a first conductive segment disposed between the first vertical c...