US Patent Issued to Western Digital Technologies on March 3 for "Staged high-density backplane for electronic modules" (Indian Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,597, issued on March 3, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Staged high-density backplane for electronic modules" was invented by Shailesh R. Nayak (Bangalore, India), Arjun Jayaprakash (Bangalore, India), Joe Paul Moolanmoozha (Bangalore, India) and Nandan Sarjapur Muniswamy (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronics backplane assembly includes respective first and second floating backplane connector assemblies each having a backplane connector coupled to a corresponding backplane plate movably coupled with a chassis wall, and a pair of stepped stoppers coupled to the chassis w...