US Patent Issued to Western Digital Technologies on Dec. 23 for "Highly textured buffer layer to grow YBiPt (110) for spintronic applications" (American, Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,856, issued on Dec. 23, was assigned to Western Digital Technologies Inc. (San Jose, Calif.).

"Highly textured buffer layer to grow YBiPt (110) for spintronic applications" was invented by Quang Le (San Jose, Calif.), Brian R. York (San Jose, Calif.), Sharon Swee Ling Banh (San Jose, Calif.), Hassan Osman (San Jose, Calif.) and Hisashi Takano (Fujisawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure generally relates to spintronic material stacks and devices. The various disclosed embodiments of YBiPt based spin orbit torque (SOT) stacks can be used for high temperature applications. Disclosed herein are various buffer a...