US Patent Issued to WALTON ADVANCED ENGINEERING on March 3 for "Chip package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,847, issued on March 3, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan).

"Chip package and method of manufacturing the same" was invented by Hong-Chi Yu (Kaohsiung, Taiwan), Chun-Jung Lin (Kaohsiung, Taiwan) and Ruei-Ting Gu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and a method of manufacturing the same are provided. The chip package includes at least one insulating protective layer disposed on a periphery of a surface of a seed layer correspondingly. A plurality of insulating protective layers is arranged at the seed layer of a plurality of rectangular chips of a wafer and located corresp...