US Patent Issued to WALTON ADVANCED ENGINEERING on Jan. 20 for "Chip package unit, method of manufacturing the same, and package structure formed by stacking the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,760, issued on Jan. 20, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan).

"Chip package unit, method of manufacturing the same, and package structure formed by stacking the same" was invented by Hong-Chi Yu (Kaohsiung, Taiwan), Chun-Jung Lin (Kaohsiung, Taiwan) and Ruei-Ting Gu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package unit, a method of manufacturing the same, and package structure formed by stacking the same are provided. At least one first connecting pad, at least one second connecting pad, and at least one third connecting pad of a flexible printed circuit (FPC) board in the chip package ...