US Patent Issued to VueReal on Aug. 11 for "Integration and bonding of micro-devices into system substrate" (Canadian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,781, issued on Aug. 11, was assigned to VueReal Inc. (Waterloo, Canada).

"Integration and bonding of micro-devices into system substrate" was invented by Gholamreza Chaji (Waterloo, Canada) and Bahareh Sadeghimakki (Kitchener, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conducti...