US Patent Issued to Volantis Semiconductor on Aug. 18 for "Cold plate cooling for wafer-scale integration with back side modular power delivery" (California Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,921, issued on Aug. 18, was assigned to Volantis Semiconductor Inc. (Portland, Ore.).

"Cold plate cooling for wafer-scale integration with back side modular power delivery" was invented by Kevin Nan Lam (Pleasanton, Calif.) and Tapabrata Ghosh (Oakland, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for cooling are disclosed. A wafer-scale silicon interposer (WSSI) is accessed. A front side of the WSSI is bonded to a plurality of functional chips. The chips create heat during operation. The WSSI includes a plurality of through-silicon vias (TSVs). A back side of the WSSI is coupled to a plurality of DC-to-DC power converters. A col...