US Patent Issued to Voidless on June 23 for "Method and plant for manufacturing a secondary packaging according to the BOD logic" (Italian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,278, issued on June 23, was assigned to Voidless S.r.l. (Milano Mi, Italy).

"Method and plant for manufacturing a secondary packaging according to the BOD logic" was invented by Mattia Bertolani (Milan), Carlo Villani (Milan), Daniel Kaidanovic (Milan) and Guglielmo Franco Riva (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure concerns a method for manufacturing a secondary packaging according to the BOD logic. The method in particular envisages managing a plurality of orders, each comprising a plurality of items. For each item, it is defined the primary cuboid circumscribed to it and for each order, it is identified the most comp...