US Patent Issued to VITESCO TECHNOLOGIES on April 14 for "Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,391, issued on April 14, was assigned to VITESCO TECHNOLOGIES GMBH (Regensburg, Germany).

"Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module" was invented by Detlev Bagung (Munich), Christina Quest-Matt (Munich) and Holger Baldreich (Nuremberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board for a power semiconductor module, having at least one top side and one bottom side, wherein at least one mounting area for a power semiconductor component is provided on the top side, wherein on the mounting area, at least one solder layer ...