US Patent Issued to VisEra Technologies on Aug. 18 for "Sensing structure, sensing chip including the same, and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,575, issued on Aug. 18, was assigned to VisEra Technologies Co. Ltd. (Hsin-Chu City, Taiwan).

"Sensing structure, sensing chip including the same, and method for forming the same" was invented by Yi-Hsin Tai (Hsin-Chu City, Taiwan), Hsin-Yi Hsieh (Hsin-Chu City, Taiwan) and Chin-Chuan Hsieh (Hsin-Chu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensing structure, a sensing chip including the sensing structure, and method for forming the sensing structure are provided. The sensing structure includes a substrate and a metal layer. The substrate has a first recess. The metal layer is disposed on the substrate. The metal layer includes ...