US Patent Issued to VIA Technologies on Dec. 23 for "Package substrate, chip package and integrated circuit chip" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,060, issued on Dec. 23, was assigned to VIA Technologies Inc. (New Taipei, Taiwan).

"Package substrate, chip package and integrated circuit chip" was invented by Wen-Yuan Chang (New Taipei, Taiwan), Yeh-Chi Hsu (New Taipei, Taiwan) and Gao-Tian Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate has a substrate surface and a chip region on the substrate surface. The package substrate includes circuit layers, conductive vias, and byte region rows. The circuit layers are sequentially spaced below the substrate surface. Each conductive via is connected to at least two of the circuit layers. The byte region rows ar...