ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,190, issued on Nov. 3, was assigned to VERTIV Corp. (Westerville, Ohio).
"Module snap device and module" was invented by Junjie Chen (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a module snap device and a module. The module snap device includes a snap spring strip and a handle. An end of the snap spring strip is fixed in a mounting groove extending from the interior of a mounting side of the module to a module panel, another end of the snap spring strip extends from the mounting groove to the front of the module panel, the snap spring strip is provided with at least one snap block protruding from a...