US Patent Issued to Vanguard International Semiconductor on Sept. 22 for "Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,863, issued on Sept. 22, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same" was invented by Rakesh Chand (Singapore), Ramachandramurthy Pradeep Yelehanka (Singapore), Sock Kuan Soo (Singapore), Poh Liang Yap (Singapore) and Guofu Zhou (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectromechanical systems (MEMS) package includes a first MEMS package and a second MEMS package laterally spaced apart from the first MEMS package. The first MEMS package includes a first device substra...