US Patent Issued to Vanguard International Semiconductor on Sept. 15 for "Silicon photonic platform, method for forming composite platform and method for forming silicon photonic platform" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,749, issued on Sept. 15, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Silicon photonic platform, method for forming composite platform and method for forming silicon photonic platform" was invented by Ming-Cheng Lo (New Taipei City, Taiwan), Shih-Chang Huang (Hsinchu City, Taiwan), Jui-Chun Chang (Hsinchu City, Taiwan), Wu-Hsi Lu (Hsinchu City, Taiwan), Yu-Che Tsai (Hsinchu City, Taiwan), Shih-Hao Liu (Taoyuan City, Taiwan) and Yen-Shih Ho (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A silicon photonic platform includes a composite substrate with a first photonic platform layer which include...