US Patent Issued to Vanguard International Semiconductor on July 14 for "Micro-electro-mechanical system package and fabrication method thereof" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,722, issued on July 14, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Micro-electro-mechanical system package and fabrication method thereof" was invented by Jia Jie Xia (Singapore) and Guofu Zhou (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and th...