US Patent Issued to Vanguard International Semiconductor on Jan. 20 for "Semiconductor substrates, fabrication methods thereof and micro-electro-mechanical system (MEMS) devices" (Singaporean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,664, issued on Jan. 20, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan).

"Semiconductor substrates, fabrication methods thereof and micro-electro-mechanical system (MEMS) devices" was invented by Rakesh Chand (Singapore), Muniandy Shunmugam (Singapore) and Ramachandramurthy Pradeep Yelehanka (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor substrate includes the following steps. A first wafer is provided and a first surface of the first wafer is etched to form a plurality of cavities. A second wafer is formed on the first surface, where forming the second wafer includes th...