US Patent Issued to UTAC HEADQUARTERS on May 19 for "Semiconductor packages with reliable covers" (Singaporean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,276, issued on May 19, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore).

"Semiconductor packages with reliable covers" was invented by Il Kwon Shim (Singapore) and Jeffrey Punzalan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is disclosed. The package includes a sensor die which is disposed on a package substrate. A cover structure is attached to a cover adhesive surrounding the sensor die, forming a cavity above the sensor die. The cover structure includes a primary cover structure and a secondary cover structure surrounding the primary cover structure. The secondary cover structure is configured to protec...