US Patent Issued to UTAC Headquarters on Jan. 13 for "Semiconductor device and method of forming clip bond having multiple bond line thicknesses" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,567, issued on Jan. 13, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Semiconductor device and method of forming clip bond having multiple bond line thicknesses" was invented by Hyung Mook Choi (Freemont, Calif.) and Edgardo R. Hortaleza (Pacifica, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a leadframe and a first electrical component disposed over the leadframe. A clip bond is disposed over the first electrical component. The clip bond has a plurality of recesses each having a different depth. A first recess is proximate to a first distal end of the first electrical component, and a second recess is...