US Patent Issued to University of South Florida on July 21 for "Method of forming patterns in layered materials at an atomic scale" (Florida Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,148, issued on July 21, was assigned to University of South Florida (Tampa, Fla.).

"Method of forming patterns in layered materials at an atomic scale" was invented by Michael Cai Wang (Tampa, Fla.) and YunJo Jeong (Tampa, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a layered material including arranging a 2DLM on a base material comprising one or more Moire interferences, and adding material or removing material at a location of the one or more Moire interferences."

The patent was filed on Feb. 8, 2021, under Application No. 17/170,103.

*For further information, including images, charts and tables, please visit: http:/...