US Patent Issued to UNIVERSITY OF FLORIDA RESEARCH FOUNDATION on Jan. 20 for "Digital twin modeling of IC packaging structure" (Florida Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,013, issued on Jan. 20, was assigned to UNIVERSITY OF FLORIDA RESEARCH FOUNDATION Inc. (Gainesville, Fla.).

"Digital twin modeling of IC packaging structure" was invented by Navid Asadi-Zanjani (Gainesville, Fla.), John True (Gainesville, Fla.) and Chengjie Xi (Gainesville, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments are directed to analysis of three-dimensional structure of an integrated circuit (IC) sample in order to enable sample preparation for physical inspection and hardware assurance. Specifically, various embodiments provide a structural analysis framework that enables high-quality sample preparation, including c...