US Patent Issued to UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA on May 12 for "Method for robot assisted multi-view 3D scanning measurement based on path planning" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,344, issued on May 12, was assigned to UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA (Chengdu, China).

"Method for robot assisted multi-view 3D scanning measurement based on path planning" was invented by Chun Yin (Chengdu, China), Yan Gao (Chengdu, China), Zhongbao Yan (Chengdu, China), Kai Chen (Chengdu, China), Yuhua Cheng (Chengdu, China), Xutong Tan (Chengdu, China) and Junyang Liu (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a method for robot assisted multi-view 3D scanning measurement based on path planning. Firstly, establishing a virtual simulation platform to complete the setting ...